Method of making double level polysilicon series transistor devices

ABSTRACT

A plurality of MOS transistors are formed as an integrated semiconductor device, adjacent transistors sharing a common source/drain region which is created by the edges of inverted regions beneath the gates of the transistors. These gates are first and second level polysilicon, with the second partly overlapping the first. On the opposite ends, the source and drain regions are formed by diffusion using the oxide under the first and second level poly as the diffusion mask.

RELATED CASE

This is a division of application Ser. No. 102,301 filed Dec. 10, 1979now U.S. Pat. No. 4,319,263 which in turn is continuation-in-part of myprior copending application Ser. No. 907,234, filed May 18, 1978 nowU.S. Pat. No. 4,213,139, assigned to Texas Instruments.

BACKGROUND OF THE INVENTION

This invention relates to semiconductor devices, and more particularlyto a series pair of N-channel silicon gate transistors and a process formaking them.

In MOS integrated circuits such as sense amplifiers for dynamic memoryarrays, or in various logic gates, pairs of transistors are connectedwith their source-to-drain paths in series. Usually a sharedsource/drain region between the two is a diffused N+ region, whichoccupies unnecessary space on the chip and introduces unwanted overlapcapacitance and node capacitance, slowing the operation of the circuit.

A double level polysilicon process is widely used to make one-transistormemory cells, as described in U.S. patent application Ser. No. 648,594,filed Jan. 12, 1976, and Ser. No. 722,841, filed Sept. 13, 1976 now U.S.Pat. No. 4,240,092, assigned to Texas Instruments. In this process, acapacitor is formed by the first level poly, and the transistor gate isformed by the second level which partly overlaps the first. Heretofore,the advantages of this structure have not been utilized in a seriestransistor structure.

It is the principal object of this invention to provide a semiconductordevice in the form of a series transistor pair of small size and withreduced overlap capacitance and node capacitance. Another object is toprovide a small-area series transistor pair which is made by a processcompatible with standard N-channel silicon gate manufacturingtechniques.

SUMMARY OF THE INVENTION

In accordance with an embodiment of the invention, a semiconductordevice such as a metal-oxide-semiconductor or MOS series transistor pairis formed in an integrated circuit along with other transistors forperipheral circuitry. The transistor pair has gates formed byoverlapping layers of double level polycrystalline silicon. No separatediffused region is used as the source/drain node between the seriestransistors, but instead the inverted region below the gate of one formsthe source or drain of the other.

BRIEF DESCRIPTION OF THE DRAWINGS

The novel features believed characteristic of the invention are setforth in the appended claims. The invention itself, however, as well asother features and advantages thereof, will be best understood byreference to the detailed description which follows, read in conjunctionwith the accompanying drawings, wherein:

FIG. 1 is a greatly enlarged plan view of a small portion of asemiconductor chip showing the physical layout of a pair of transistorsmade according to the invention;

FIG. 2 is an electrical schematic diagram of the transistor pair of FIG.1;

FIG. 3 is an elevation view in section of the cell of FIG. 1, takenalong the line 3--3;

FIGS. 4a-4c are elevation views in section of the semiconductor deviceof FIG. 1 and at successive stages in the manufacturing process, takengenerally along the lines 3--3 in FIG. 1; and

FIG. 5 is an electrical schematic diagram of a sense amplifier using thefeatures of the invention.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENT

With reference to FIG. 1, a pair of transistors 10 and 11 employing thefeatures of the invention is illustrated in cross section while FIG. 2shows the same transistor pair in electrical schematic form. Thetransistor 10 has an N+ source 12 and a drain 13, and the transistor 11shares a common area which functions as the drain 13 of the transistor10 and the source of the transistor 11, and has an N+ drain 14. Thegates 15 and 16 are separately connected to logic level inputs 17 and18. An output node 19 is connected to the drain 14, and a load device 20such as a transistor connects the output node to a Vdd positive voltagesupply. The circuit is of course merely illustrative since the inventioncould be used in many different logic gates, flip-flops, or the like.

According to the invention, the gates 15 and 16 are formed separately offirst and second level polycrystalline silicon, with an insulatingcoating 21 separating the two. A gate insulator 22 separates the gate 15from its underlying induced channel, and a gate insulator 23 underliesthe gate 16; typically the gate insulators are thermal silicon oxide.When a positive voltage of more than the threshold voltage Vt, typically+0.8 v., is applied to the gate 15 then a region 24 under the gate willinvert, creating a channel or in effect creating a surface-adjacentN-type region. The right hand edge of this region 24 provides thesource/drain 13 for the other transistor. Similarly, if the gate 16 hasa positive voltage on it, an inverted channel region 25 is created, andthe left hand edge of this inverted region provides the source/drain 13of the transistor 10.

The advantages of the structure of FIGS. 1-3 are reduced overlapcapacitance, reduced capacitance of the node 13, and smaller cell size.When an N+ diffusion is performed to create the regions 12 and 14, thereis diffusion beneath the gate oxide 22 or 23 to produce an overlapbetween the outer edges of the gates 15 and 16 and the lateral N+diffused portions of the regions 12 and 14. Ordinarily, if theintermediate source/drain region 13 were formed by the same diffusion asis usually the case, this same lateral diffusion would take place,resulting in additional overlap capacitance and also producing so-calledshort channel effects. But since the source/drain 13 is created by theedges of inverted regions 24 and 25, this added overlap capacitance doesnot exist, and the short channel effects are not as prevalent.Furthermore, the capacitance to the substrate which would have occurredbetween a diffused N+ region corresponding to the region 13 does notexist. When both transistors are off, the capacitance of thesource/drain node 13 is virtually zero. Almost no voltage can be storedon this node and so the circuit can operate faster since the node neednot be charged or discharged. In addition, the space usually occupied bya diffused region 13 between the two gates 15 and 16 is eliminated, sothe cell size is much smaller.

Turning now to FIGS. 4a-4c, a process for making the ROM array of theinvention will be described. The starting material is a slice of P-typemonocrystalline silicon; in the FIGURES the portion shown of the bar 30represents only a very small part of the slice, perhaps 1 or 2 mils widefor each part. After appropriate cleaning, the slice is oxidized byexposing to oxygen in a furnace at an elevated temperature to produce anoxide layer 31 over the entire slice of a thickness of about 1000Angstroms. A layer 32 of silicon nitride of about 1000 Angstromsthickness is formed over the entire slice by exposing to an atmosphereof dichlorosilane and ammonia in a CVD reactor. A coating of photoresistis applied to the entire top surface of the slice, then exposed toultraviolet light through a mask which defines the desired pattern ofthick field oxide and underlying P+ channel stop. The resist isdeveloped, leaving areas where nitride is then etched away by a nitrideetchant, removing the exposed part of the nitride layer 32 but leavingin place the oxide layer 31.

Using the photoresist and nitride as a mask, the slice is now subjectedto an ion implant step to produce channel stop regions, whereby boronatoms are introduced into unmasked regions 33 of silicon. The oxidelayer 31 is left in place during the implant because it prevents theimplanted boron atoms from out-diffusing from the surface duringsubsequent heat treatment. The regions 33 do not exist in the same formin the finished device, because some of this part of the slice will havebeen consumed in the field oxidation procedure. Usually the slice wouldbe subjected to a heat treatment after implant but prior to field oxidegrowth, as set forth in my U.S. Pat. No. 4,055,444, assigned to TexasInstruments.

The next step in the process is formation of field oxide 34, which isdone by standard thermal oxidizing techniques. This causes a thick fieldoxide region or layer 34 to be grown as seen in FIG. 4b. This regionextends into the silicon surface because silicon is consumed as itoxidizes. The remaining parts of the nitride layer 32 mask oxidation.The thickness of this layer 34 is about 10,000 Angstroms, about half ofwhich is above the original surface and half below. The boron doped P+regions 33 formed by implant will be partly consumed, but will alsodiffuse further into the silicon ahead of the oxidation front. Thus, P+field stop regions 35 will result which will be much deeper than theoriginal regions 33.

Next the remaining nitride layer 32 is removed by an etchant whichattacks nitride but not silicon oxide, then the oxide 31 is removed byetching and the exposed silicon cleaned. The gate oxide 22 is grown bythermal oxidation to a thickness of perhaps 800 Angstroms. As will beseen, the gate oxide layer 22 may be grown a different thickness thanthe gate oxide 23 because they are grown at different times. In areas ofthe slice where depletion load devices are required, although notpertinent to this invention, a masked ion implant step would be done atthis point. Likewise, the threshold voltage of enhancement modetransistors may be adjusted by ion implant. Also, windows for firstpolysilicon to silicon contacts, if needed, are patterned and etched atthis point using photoresist; none are needed in the transistors shown.

As seen in FIG. 4b a first layer of polycrystalline silicon is depositedover the entire slice in a reactor using standard techniques, to athickness of about 5000 Angstroms. Prior to patterning, this first polylayer is doped with phosphorus by an N+ diffusion to make it highlyconductive. The first polysilicon layer is patterned by applying a layerof photoresist, exposing to ultraviolet light through a mask preparedfor this purpose, developing, then etching both polysilicon and exposedoxide. The photoresist masks certain areas of the polysilicon to definethe gate 15 and other transistor gates on the chip not pertinent to thisinvention. The unmasked polycrystalline silicon is etched away, so theresulting structure is seen in FIG. 4b.

According to the invention, the gate 16 is applied in a separatepolysilicon deposition operation instead of in the same operation whichdefined the gate 15. A thermal oxide coating 21 is first applied to thefirst level poly and the gate oxide 23 is formed as seen in FIG. 4c byexposing the slice to steam or an oxygen atmosphere at high temperatureto produce the coatings 21 and 23 of about 800 Angstroms or otherthickness if a different threshold or other characteristic is desiredfor this transistor compared to the transistor 10. The coating 21 actsas an insulator where the first and second level poly overlaps, and alsoacts as an etch barrier when patterning the second level. The secondpoly is deposited by standard techniques to produce a layer of about5000 Angstroms covering the entire slice. It is then patterned byphotoresist to define the gate 16, as well as gates 39 of othertransistors and interconnections in the peripheral circuitry on thechip. Then, the thin thermal oxide 21 and 23 is removed everywhereexcept under the gate 16 and the overlap, using the second level poly asan etch mask so self-alignment is provided. Now the slice it subjectedto a standard N+ diffusion operation to produce the N+ source and drainregions 12 and 14 for the transistors 10 and 11, as well as otherperipheral transistors. At the same time, the second level polyincluding the gate 16 is heavily doped to render it conductive. Theresulting structure is that of FIG. 3.

A thick layer of silicon oxide (not shown) is deposited by decompositionof silane at a low temperature to insulate the metal from thepolycrystalline silicon, and is referred to as multilevel oxide. Themultilevel oxide layer is patterned by a photoresist operation, exposingcontact areas for metal-to-polysilicon contacts and for metal-to-siliconcontacts. Metal contacts and interconnections are used in variouscircuitry of a typical chip, as well as for the bonding pads whichprovide connection to external electrodes. The metal contacts andinterconnections are made in the usual manner by depositing a thin filmof aluminum over the entire top surface of the slice then patterning itby a photoresist mask and etch sequence. Usually a protectiveovercoating of low temperature oxide would be added over themetallization, then the slice scribed and broken into individual chips,and the chips mounted in packages.

In FIG. 5, a sense amplifier of the typical bistable type which may usethe series transistor pair of the invention is shown. The output nodeswould be connected to respective halves of the column lines of an MOSrandom access memory array of the type shown in FIG. 3 of U.S. Pat. No.4,081,701, assigned to Texas Instruments. Also, the output nodes wouldbe cross coupled to the gates 15 of the driver transistors 10 of theopposite half. Aside from smaller size, the advantages of the inventionin this circuit is that the nodes 13 would not store charge and thusslow up the operation.

Another embodiment of the invention is illustrated in FIGS. 6,7 and 8,which show a three transistor cell using series transistors. Here thetransistor 10 in the center is actually used as a dummy capacitor in adynamic RAM cell array of the type shown in Electronics, Sept. 28, 1978,at pp. 109-116. The transistor 11 is the dummy cell access transistorwhich has the Xdum row address line connected to its gate 16 by line 18.The third transistor 40 has its gate 41 connected by line 42 to aprecharge clock voltage ΦPC. The gate 15 of the dummy cell capacitance(transistor 10) is permanently connected to a bias voltage Vdd,typically +5 V, by the line 17. The line 19 in this case is the bit linehalf or column line half which has 128 one-transistor memory cellsconnected to it (in a 64K bit RAM) and which is also connected to oneside of a bistable differential sense amplifier. The load device 20 isthe load for the sense amplifier and may be of the type shown in U.S.Pat. No. 4,081,701, issued to White, McAdams and Redwine, assigned toTexas Instruments. In operation of the circuit of FIG. 7, first ΦPC goesto logic 1 and predischarges the capacitor 10 to ground through thetransistor 40; that is, the inverted region 24 forming the lower plateof the dummy cell capacitance is discharged. At this point Xdum is atlogic 0. Next, ΦPC goes to logic 0 or Vss, and then if this row of dummycells is selected by the X decoder the line 18 goes to logic 1 as Xdumgoes high. With transistor 40 off and transistor 11 on, the column linehalf 19 will discharge slightly into the capacitance of the transistor10. Typically, the dummy cell capacitance is about one-third the size ofa memory cell capacitance in the memory cell array. The dummy cell onone side and a memory cell on the opposite side of the differentialsense amplifier are simultaneously addressed and the dummy cellcapacitance pulls down the voltage on the line 19 about halfway betweenthat produced by a 1 and that produced by a 0 on the memory cellcapacitance.

The device of FIGS. 6-8 is made by the exact same process as describedabove with reference to FIGS. 4a-4c. The gate 41 is part of the samesecond layer of polycrystalline silicon which forms the gate 16, and thegate oxide 23 for the transistor 40 is the same as that for thetransistor 11.

Instead of the sequence shown in FIGS. 6 and 8 where the gate 15 isfirst level poly, the gates 16 and 41 can be first level poly and thegate 15 second level poly. In this case, the sides of the gate 15 wouldoverlap the gates 16 and 41.

While this invention has been described with reference to illustrativeembodiments, this description is not intended to be construed in alimiting sense. Various modifications of the illustrative embodiments,as well as other embodiments of the invention, will be apparent topersons skilled in the art upon reference to this description. It istherefore contemplated that the appended claims will cover any suchmodifications or embodiments as fall within the true scope of theinvention.

What is claimed:
 1. A method of making a pair of adjacent semiconductordevices comprising the steps of applying a first layer on a face of asemiconductor body then patterning it to define an electrode of one ofthe devices, applying a second layer on said face and patterning it todefine an electrode of the other of the semiconductor devices, thesecond layer partially overlapping the first layer, then introducingimpurity material into the face using the first and second layers as amask to create regions of the semiconductor devices.
 2. A methodaccording to claim 1 wherein the semiconductor devices are insulatedgate field effect transistors and each of the first and second layersinclude an insulating coating and a conductive layer.
 3. A methodaccording to claim 2 wherein the conductive layer of the first andsecond layers is polycrystalline silicon, and the insulating coating issilicon oxide.
 4. A method according to claim 3 wherein an insulatingcoating is applied between the first layer and the second layer at thearea of said partial overlapping.
 5. A method according to claim 4wherein the step of introducing impurity material includes diffusing tocreate heavily-doped regions in the face, the silicon oxide beneath thepolycrystalline silicon of the first and second layers acting as adiffusion mask.
 6. A method of making a plurality of adjacentsemiconductor devices comprising the steps of applying a first layer ona face of a semiconductor body then patterning it to define an electrodeat least of one of the devices, applying a second layer on said face andpatterning it to define an electrode of at least one other of thedevices, the second layer partially overlapping the first layer andbeing insulated therefrom, then introducing impurity material into theface using the first and second layers as a mask to create a region ofat least two of the devices.
 7. A method according to claim 6 whereinthe semiconductor devices include at least three insulated gate fieldeffect transistors and each of the first and second layers include aconductive layer forming the gate of at least one of the transistors. 8.A method according to claim 7 wherein the first layer forms the gates ofone of said transistors and the second layer forms the gate of two ofthe transistors, said one being between such two of the transistors. 9.A method according to claim 8 wherein the step of introducing impuritymaterial includes diffusing to create heavily-doped regions in the face,and silicon oxide beneath the first and second layers acts as adiffusion mask.